傅志红，易琪，刘卫，等.微流控芯片热压成型仿真研究[J].工程塑料应用，2017，45(2)：60-63.

Fu Zhihong, Yi Qi, Liu Wei, et al. Numerical Simulation of Hot Embossing of Microfluidic Chip[J]. Engineering Plastics Application, 2017, (2).

傅志红，易琪，刘卫，等.微流控芯片热压成型仿真研究[J].工程塑料应用，2017，45(2)：60-63. DOI： 10.3969/j.issn.1001-3539.2017.02.013.

Fu Zhihong, Yi Qi, Liu Wei, et al. Numerical Simulation of Hot Embossing of Microfluidic Chip[J]. Engineering Plastics Application, 2017, (2). DOI： 10.3969/j.issn.1001-3539.2017.02.013.