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Preparation and properties of low dielectric polyimide resins based on low temperature thermal rearrangement and phenylethynyl crosslinking reactions
Materials & Applications | 更新时间：2026-07-15

    • Preparation and properties of low dielectric polyimide resins based on low temperature thermal rearrangement and phenylethynyl crosslinking reactions

    • Engineering Plastics Application   Vol. 54, Issue 6, Pages: 83-94(2026)

    • DOI：10.3969/j.issn.1001-3539.2026.06.010    

      CLC： TQ322

    • Received：05 April 2026，

      Revised：2026-04-22，

      Accepted：27 April 2026，

      Published：10 June 2026

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  • LUO Dan，WANG Xiaodong，LIU Zejian，et al. Preparation and properties of low dielectric polyimide resins based on low temperature thermal rearrangement and phenylethynyl crosslinking reactions[J]. Engineering Plastics Application，2026，54(6)：83-94. DOI： 10.3969/j.issn.1001-3539.2026.06.010.

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