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Preparation and properties of high thermal conductivity PTFE copper-clad laminates with multiple fillers
Fillers & Additives | 更新时间：2026-06-10

    • Preparation and properties of high thermal conductivity PTFE copper-clad laminates with multiple fillers

    • Engineering Plastics Application   Vol. 54, Issue 5, Pages: 207-213(2026)

    • DOI：10.3969/j.issn.1001-3539.2026.05.024    

      CLC： TB332TN41

    • Received：25 February 2026，

      Revised：2026-04-02，

      Accepted：13 April 2026，

      Published：10 May 2026

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  • GAO Shujian，FENG Chunming，WU Cong，et al. Preparation and properties of high thermal conductivity PTFE copper-clad laminates with multiple fillers[J]. Engineering Plastics Application，2026，54(5)：207-213. DOI： 10.3969/j.issn.1001-3539.2026.05.024.

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Related Author

HAN Guiyun
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Related Institution

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