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Effects of thermal conductive fillers on epoxy resin composites for electronic packaging
Fillers & Additives | 更新时间：2026-05-19

    • Effects of thermal conductive fillers on epoxy resin composites for electronic packaging

    • Engineering Plastics Application   Vol. 54, Issue 4, Pages: 210-215(2026)

    • DOI：10.3969/j.issn.1001-3539.2026.04.024    

      CLC： TQ327.8

    • Received：05 February 2026，

      Revised：2026-03-24，

      Accepted：25 March 2026，

      Published：10 April 2026

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  • DENG Wen，CHEN Liangfeng，HU Bin，et al. Effects of thermal conductive fillers on epoxy resin composites for electronic packaging[J]. Engineering Plastics Application，2026，54(4)：210-215. DOI： 10.3969/j.issn.1001-3539.2026.04.024.

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