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Collaborative quality control of in-mold thermocompression bonding process based on multi-objective optimization of PMMA microfluidic chips
Process Technology | 更新时间：2025-12-25

    • Collaborative quality control of in-mold thermocompression bonding process based on multi-objective optimization of PMMA microfluidic chips

    • “New progress has been made in microfluidic chip research, with experts optimizing process parameters to achieve rapid manufacturing of high-performance chips, providing new solutions for precision medicine and other fields.”
    • Engineering Plastics Application   Vol. 53, Issue 11, Pages: 106-116(2025)

    • DOI：10.3969/j.issn.1001-3539.2025.11.015    

      CLC：

    • Received：17 September 2025，

      Revised：2025-10-29，

      Accepted：31 October 2025，

      Published：10 November 2025

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  • ZHAO Baishun，WU Wangqing，JIANG Bingyan，et al. Collaborative quality control of in-mold thermocompression bonding process based on multi-objective optimization of PMMA microfluidic chips[J]. Engineering Plastics Application，2025，53(11)：106-116. DOI： 10.3969/j.issn.1001-3539.2025.11.015.

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