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Simulation of RTM process and void defect for CFRP flat plate based on PAM-RTM
Process Technology | 更新时间：2024-03-26

    • Simulation of RTM process and void defect for CFRP flat plate based on PAM-RTM

    • Engineering Plastics Application   Vol. 52, Issue 3, Pages: 76-82(2024)

    • DOI：10.3969/j.issn.1001-3539.2024.03.013    

      CLC： TB332

    • Received：21 January 2024，

      Published：10 March 2024

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  • ZOU Wentao，MENG Xianming，CHENG Congqian，et al. Simulation of RTM process and void defect for CFRP flat plate based on PAM-RTM[J]. Engineering Plastics Application，2024，52(3)：76-82. DOI： 10.3969/j.issn.1001-3539.2024.03.013.

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Gao Meng
Cheng Congqian
Meng Xianming
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Related Institution

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