您当前的位置：
首页 >
文章列表页 >
The Performance of a Latent Modified Imidazole Low Temperature Curing Agent/Epoxy Resin System
Fillers & Additives | 更新时间：2024-01-31

    • The Performance of a Latent Modified Imidazole Low Temperature Curing Agent/Epoxy Resin System

    • Engineering Plastics Application   Vol. 51, Issue 8, Pages: 154-159(2023)

    • DOI：10.3969/j.issn.1001-3539.2023.08.024    

      CLC： TQ32

    • Received：20 May 2023，

      Published：17 August 2023

    移动端阅览

  • Wang Zhiyuan，Chen Gang，Wei Huazhen，et al. The performance of a latent modified imidazole low temperature curing agent/epoxy resin system[J]. Engineering Plastics Application，2023，51(8)：154-159. DOI： 10.3969/j.issn.1001-3539.2023.08.024.

  •  
  •  

0

Views

3

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Synthesis of Nano Core-shell Rubber and Its Toughening Modification for Epoxy Resin
Research Progress of Low Temperature Curing Epoxy Prepreg with Long Pot Life
Curing Kinetics of Dicyandiamide Cured Epoxy System Promoted by Imidazole
Preparation and Characterization of PLA Copolymer Grafted by Glycidyl Methacrylate
Molecular dynamics simulation of impact damage in kevlar fiber/epoxy composites using deep learning potentials

Related Author

Wang Xin
Wang Dezhi
Liu Lizhu
Qu Chunyan
Yang Haidong
Wang Zhiyuan
Chen Gang
Wang Qifen

Related Institution

Harbin University of Science and Technology, Harbin
2. Institute of Petrochemistry, Heilongjiang academy of sciences, Harbin
Shandong Non-metallic Materials Institute, Jinan
School of Materials Science and Engineering of North University of China, Taiyuan
College of Polymer Science & Engineering, Sichuan University, Chengdu
0