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Numerical Simulation of Hot Embossing of PMMA Double-Sided Microfluidic Chip
更新时间：2024-01-31

    • Numerical Simulation of Hot Embossing of PMMA Double-Sided Microfluidic Chip

    • Engineering Plastics Application   Issue 6, (2021)

    • DOI：10.3969/j.issn.1001-3539.2021.06.015    

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    • Published：2021

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  • Zuo Silu, Fu Zhihong, Yu Wenqing. Numerical Simulation of Hot Embossing of PMMA Double-Sided Microfluidic Chip[J]. Engineering Plastics Application, 2021, (6). DOI： 10.3969/j.issn.1001-3539.2021.06.015.

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Related Author

Fu Zhihong
Yi Qi
Liu Wei
Zhang Lei
Zhang Zhou
Zhu Yawei
Huang Jiawei
KUANG Tangqing

Related Institution

College of Mechanical and Electrical Engineering of Central South University, Changsha
Center for Basic and Engineering Practice，East China Jiaotong University
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Jiangxi Union Plastic Science and Technology Industrial Company Limited
School of Electromechanical and Vehicle Engineering，East China Jiaotong University
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