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Curing Kinetics of TDE-85/MeTHPA/DMP-30 Resin System
更新时间：2024-01-31

    • Curing Kinetics of TDE-85/MeTHPA/DMP-30 Resin System

    • Engineering Plastics Application   Issue 12, (2020)

    • DOI：10.3969/j.issn.1001-3539.2020.12.014    

      CLC：

    • Published：2020

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  • Yang Hao, Huang Wenyu, Zhou Dong, et al. Curing Kinetics of TDE-85/MeTHPA/DMP-30 Resin System[J]. Engineering Plastics Application, 2020, (12). DOI： 10.3969/j.issn.1001-3539.2020.12.014.

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Related Author

Wang Ding
Wang Lijun
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Related Institution

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2. Shanghai Engineering Technology & Research Center of Aerospace Resin Based Composites, Shanghai
Shanghai Composite Material Science & Technology Co., Ltd., Shanghai
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