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Optimization of Injection Molding Process for Warpage of COC Chip based on Grey Relational Analysis
更新时间：2024-01-31

    • Optimization of Injection Molding Process for Warpage of COC Chip based on Grey Relational Analysis

    • Engineering Plastics Application   Issue 10, (2020)

    • DOI：10.3969/j.issn.1001-3539.2020.10.012    

      CLC：

    • Published：2020

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  • Shu Haitao, Liu Zhihua, Liang Shuai, et al. Optimization of Injection Molding Process for Warpage of COC Chip based on Grey Relational Analysis[J]. Engineering Plastics Application, 2020, (10). DOI： 10.3969/j.issn.1001-3539.2020.10.012.

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Related Author

XUE Dong
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Related Institution

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Automation School of Beijing University of Posts and Telecommunications, Beijing
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