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Progress on Research in Epoxy Resin Matrix Composites for Electronic Packaging
更新时间：2024-01-31

    • Progress on Research in Epoxy Resin Matrix Composites for Electronic Packaging

    • Engineering Plastics Application   Issue 10, (2019)

    • DOI：10.3969/j.issn.1001-3539.2019.10.027    

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    • Published：2019

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  • Zhang Chao, Bai Ruiqin, Ma Yong, et al. Progress on Research in Epoxy Resin Matrix Composites for Electronic Packaging[J]. Engineering Plastics Application, 2019, (10). DOI： 10.3969/j.issn.1001-3539.2019.10.027.

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