您当前的位置：
首页 >
文章列表页 >
Research Development on Thermal Conductivity of PEEK
更新时间：2024-01-31

    • Research Development on Thermal Conductivity of PEEK

    • Engineering Plastics Application   Issue 5, (2019)

    • DOI：10.3969/j.issn.1001-3539.2019.05.027    

      CLC：

    • Published：2019

    移动端阅览

  • Li Aqiang, Chen Qihai, Huo Shaoxin, et al. Research Development on Thermal Conductivity of PEEK[J]. Engineering Plastics Application, 2019, (5). DOI： 10.3969/j.issn.1001-3539.2019.05.027.

  •  
  •  

0

Views

2

下载量

3

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Shielding performance，thermal conductivity and mechanical properties of boron containing high temperature resistant epoxy resin shielding material
Preparation and Properties of CNTs-A2O3 Synergistic Modified Thermoplastic Polyurethane Composite
Research progress in modification and application of polyphenylene sulfide
Research progress of conductive polyetheretherketone
Optimization of impact performance of CGF/PEEK additive manufactured samples using response surface methodology

Related Author

YU Ming
WANG Yiyuan
WU Rongjun
NIE Lingxiao
ZHU Guohua
JIA Jingxuan
XU Xiaohui
CHEN Cheng

Related Institution

Wuhan Second Ship Design and Research Institute
Innovation Center for Ocean Nuclear Emergency Radiation Monitoring and Protection Technology
College of Materials Science and Engineering, Xihua University, Chengdu
Jinan Enterprise Technology Progress Promotion Center
School of Chemistry and Chemical Engineering，Gannan Normal University
0