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Electroless Copper Plating Technology of Rigid PMI Foam and Its Electromagnetic Properties
更新时间：2024-01-31

    • Electroless Copper Plating Technology of Rigid PMI Foam and Its Electromagnetic Properties

    • Engineering Plastics Application   Issue 5, (2019)

    • DOI：10.3969/j.issn.1001-3539.2019.05.013    

      CLC：

    • Published：2019

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  • Wang Aifeng, Zhang Guangcheng, Li Jianwei, et al. Electroless Copper Plating Technology of Rigid PMI Foam and Its Electromagnetic Properties[J]. Engineering Plastics Application, 2019, (5). DOI： 10.3969/j.issn.1001-3539.2019.05.013.

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