您当前的位置：
首页 >
文章列表页 >
Finite Element Simulation of Thermal Conductivity for PI Enhanced by AgNPs/BNNSs Hybrid Filler
更新时间：2024-01-31

    • Finite Element Simulation of Thermal Conductivity for PI Enhanced by AgNPs/BNNSs Hybrid Filler

    • Engineering Plastics Application   Issue 4, (2019)

    • DOI：10.3969/j.issn.1001-3539.2019.04.023    

      CLC：

    • Published：2019

    移动端阅览

  • Wu Xinjian, Hu Xiaodan, Zhang Haiqian, et al. Finite Element Simulation of Thermal Conductivity for PI Enhanced by AgNPs/BNNSs Hybrid Filler[J]. Engineering Plastics Application, 2019, (4). DOI： 10.3969/j.issn.1001-3539.2019.04.023.

  •  
  •  

0

Views

1

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Preparation and properties of diamond gel abrasives with polyimide of different solid contents
Research progress on synthesis of polyhedral oligomeric silsesquioxanes and their modified polymers
Effects of fiber flow lay-up on mechanical properties of jute/polypropylene composites based on finite element simulation
Fatigue failure modes and damage mechanisms of laminated transparent components
Preparation and properties of thermal conductivity-enhanced PEG-based solid-solid phase change composites

Related Author

DONG Mingli
WANG Yuanyuan
CAI Zhonghao
LI Yifan
WANG Yaoyue
LIU Qingyang
PENG Jin
ZHAO Xiang

Related Institution

School of Materials Science and Engineering，Henan University of Technology
Shandong Institute of Non-metallic Materials
School of Textile Science and Engineering，Tiangong University
Shaoxing City Quality and Technical Supervision and Testing Institute
Baimtec Material Co.，Ltd.
0