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Research Progress of Thermal Conductive Epoxy Matrix Composites for Electronic Packaging
更新时间：2024-01-31

    • Research Progress of Thermal Conductive Epoxy Matrix Composites for Electronic Packaging

    • Engineering Plastics Application   Issue 12, (2018)

    • DOI：10.3969/j.issn.1001-3539.2018.12.028    

      CLC：

    • Published：2018

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  • Xie Yuning, Lei Hua, Shi Qian. Research Progress of Thermal Conductive Epoxy Matrix Composites for Electronic Packaging[J]. Engineering Plastics Application, 2018, (12). DOI： 10.3969/j.issn.1001-3539.2018.12.028.

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