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Numerical Simulation of Hot Embossing of Microfluidic Chip
更新时间：2024-01-31

    • Numerical Simulation of Hot Embossing of Microfluidic Chip

    • Engineering Plastics Application   Issue 2, (2017)

    • DOI：10.3969/j.issn.1001-3539.2017.02.013    

      CLC：

    • Published：2017

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  • Fu Zhihong, Yi Qi, Liu Wei, et al. Numerical Simulation of Hot Embossing of Microfluidic Chip[J]. Engineering Plastics Application, 2017, (2). DOI： 10.3969/j.issn.1001-3539.2017.02.013.

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Related Author

Yu Wenqing
Fu Zhihong
Zuo Silu
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DUAN Kunyu
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Related Institution

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