您当前的位置：
首页 >
文章列表页 >
Modification of Flame Retardant Epoxy Resin as Electronic Encapsulating Material
更新时间：2024-01-31

    • Modification of Flame Retardant Epoxy Resin as Electronic Encapsulating Material

    • Engineering Plastics Application   Issue 10, (2016)

    • DOI：10.3969/j.issn.1001-3539.2016.10.028    

      CLC：

    • Published：2016

    移动端阅览

  • Zhou Beiming. Modification of Flame Retardant Epoxy Resin as Electronic Encapsulating Material[J]. Engineering Plastics Application, 2016, (10). DOI： 10.3969/j.issn.1001-3539.2016.10.028.

  •  
  •  

0

Views

3

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Molecular dynamics simulation of impact damage in kevlar fiber/epoxy composites using deep learning potentials
Bending behavior of carbon fiber reinforced polymer laminates enhanced by nanoparticle-modified epoxy resin under hygrothermal conditions
Research progress on synthesis of polyhedral oligomeric silsesquioxanes and their modified polymers
Surface modification of cotton stalks by coupling agent and its effect on properties of epoxy resin-based composites
Thermoforming and interfacial optimization of PE-UHMW/TPU composite fabric

Related Author

LI Yaqin
WU Huien
WANG Zilin
NIU Renjun
YIN Huiyong
WANG Yiqing
YANG Luxia
FU Yizheng

Related Institution

School of Materials Science and Engineering, North University of China
Shanxi Province Key Laboratory of Functional Polymer Composites, School of Materials Science and Engineering, North University of China
The Military Representative Office of the Army Equipment Department in a Designated Region
College of Chemistry and Chemical Engineering, Taiyuan University of Technology
School of Computer Science and Technology, Taiyuan Normal University
0