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《工程塑料应用》 2024年第01期
DOI:10.3969/j.issn.1001-3539.2024.01.012
黏结剂辅助微流控芯片异种键合及可行性探究
李疏桐1,刘坡2,黄继杰2,韩鹏彪1
1.河北科技大学材料科学与工程学院,河北省材料近净成形技术重点实验室,石家庄 050018; 2.桂林航天工业学院机电工程学院,广西桂林 541004 
Investigation on dissimilar bonding and feasibility of binder-assisted microfluidic chip
LI Shutong1 , LIU Po2 , HUANG Jijie2 , HAN Pengbiao1
1. Hebei Key Laboratory of Near-Net Forming Technology of Materials, College of Materials Science and Engineering, Hebei University of Science and Technology, Shijiazhuang 050018, China; 2. Guilin University of Aerospace Technology, School of Mechanical Engineering, Guilin 541004, China 
摘要:以聚甲基丙烯酸甲酯(PMMA)、聚苯乙烯(PS)、铝合金Al5052为研究对象,采用黏结剂与热压键合相结合的方法,分别进行了PMMA-PS、PMMA-Al5052异种键合正交实验。旨在探讨键合层厚度及表观形貌的变化规律,研究键合温度、压力和时间对异种键合强度的影响。结果表明:键合层厚度随温度和压力的增大而减小,而时间对键合层厚度无明显影响;聚酰亚胺(PI)辅助PMMA-PS和PMMA-Al5052的键合强度受时间影响最大,温度次之,压力最小;而溶解PMMA粉末的丙酮溶液[丙酮溶液(PMMA)]辅助PMMA-Al5052的键合强度受压力影响最大,温度次之,时间最小;同参数下PMMA-PS的键合强度远高于PMMA-Al5052。分别确立了异种键合的最优参数并得到了对应的键合强度:PI辅助PMMA-PS键合的最优参数为105 ℃,50 min,2.5 MPa,对应键合强度0.87 MPa;PI辅助PMMA-Al5052键合的最优参数为110 ℃,50 min,1.25 MPa,对应键合强度0.21 MPa;丙酮溶液(PMMA)辅助PMMA-Al5052键合的最优参数为110 ℃,2.5 MPa,20 min,对应键合强度0.41 MPa,均高于正交实验设计方案中的所有结果。参数一定时,PMMA-PS的键合强度远高于PMMA-Al5052的键合强度。采用丙酮溶液(PMMA)辅助键合PMMA-Al5052时,键合强度高于PI辅助的键合强度。 
Abstract:Polymethyl methacrylate (PMMA), polystyrene (PS) and aluminum alloy Al5052 were used as the research objects. The orthogonal experiments of PMMA-PS and PMMA-Al5052 dissimilar bonding were carried out by combining binder and hot pressing bonding. The purpose of this study is to investigate the variation of the thickness and apparent morphology of the bonding layer, and to study the effects of bonding temperature, pressure and time on the strength of dissimilar bonding. The results show that the thickness of the bonding layer decreases with the increase of temperature and pressure, while the time has no obvious effect on the thickness of the bonding layer. The bonding strength of polyimide (PI) assisted PMMA-PS and PMMA-Al5052 is most affected by time, followed by temperature and pressure. The bonding strength of PMMA-Al5052 assisted by acetone solution (PMMA) is most affected by pressure, followed by temperature and time. The bonding strength of PMMA-PS is much higher than that of PMMA-Al5052 under the same parameters. The optimal parameters of dissimilar bonding were established and the corresponding bonding strength was obtained. The optimal parameters of PI assisted PMMA-PS bonding are 105 ℃, 50 min, 2.5 MPa, and the corresponding bonding strength is 0.87 MPa. The optimal parameters of PI assisted PMMA-Al5052bonding are 110 ℃, 50 min, 1.25 MPa, and the corresponding bonding strength is 0.21 MPa. The optimal parameters of PMMA-Al5052 bonding assisted by acetone solution (PMMA) are 110 ℃, 2.5 MPa, 20 min, and the corresponding bonding strength is 0.41 MPa, which are higher than all the results in the orthogonal experimental design scheme. When the parameters are constant, the bonding strength of PMMA-PS is much higher than that of PMMA-Al5052. The bonding strength of PMMA-Al5052 assisted by acetone solution (PMMA) is higher than that assisted by PI. 
关键词:异种键合;黏结剂;聚甲基丙烯酸甲酯;聚苯乙烯;Al5052;键合层形貌;键合强度 
Keywords:heterogenic bonding; binder; polymethyl methacrylate; polystyrene; Al5052; bonding layer morphology; bonding strength 
本文引用格式:
李疏桐,刘坡,黄继杰,等.黏结剂辅助微流控芯片异种键合及可行性探究[J].工程塑料应用,2024,52(1):77−83.
LI Shutong,LIU Po,HUANG Jijie,et al. Investigation on dissimilar bonding and feasibility of binder-assisted microfluidic chip[J]. Engineer‐ ing Plastics Application,2024,52(1):77−83. 

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