收藏我们   ENGLISH  
客服QQ
  点击这里给我发消息505255386
微信
  微信公共号
关键词查询
范围:  
提 交
《工程塑料应用》 2021年第06期
DOI:10.3969/j.issn.1001-3539.2021.06.015
PMMA双面微流控芯片热压成型数值模拟
左思璐,傅志红,余文清
中南大学机电工程学院,长沙 410083 
Numerical Simulation of Hot Embossing of PMMA Double-Sided Microfluidic Chip
Zuo Silu, Fu Zhihong, Yu Wenqing
College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China 
摘要:针对某公司设计的双面微流控芯片进行热压成型数值模拟,该微流控芯片集成了微流道、微孔阵列和微腔阵列,可以同时实现样品注射、液体迁移和核酸扩增等功能,实现单一样本的不同项目同时检测。利用有限元软件DEFORM-3D,考虑聚甲基丙烯酸甲酯(PMMA)材料的黏弹性行为,对双面微结构微流控芯片热压成型过程进行数值模拟,以微结构表征点的相对误差作为评价标准,建立简化的三维模型,研究了下压距离、热压压力、热压温度和热压时间对微结构复制情况的影响。数值模拟表明,可通过热压方式一次性成型具有通孔阵列和双面微结构的PMMA微流控芯片,当下压距离为1.4 mm、热压温度为130℃、热压压力4 kN、热压时间为60 s时,成型效果最好。 
Abstract:Dumerical simulation of hot empress molding was carried out for a double-sided microfluidic chip designed by a company. The chip integrated with microfluidic channels, microwell arrays and microcavity arrays, which could realize the functions of sample injection, liquid migration, nucleic acid amplification and other functions, to achieve different items of a single sample simultaneously detected. Using the finite element software DEFORM-3D, a numerical simulation of the hot embossing process of the polymethylmethacrylate (PMMA) double-sided microstructure microfluidic chip was carried out. The viscoelastic material model of PMMA was established in the simulation and the relative error of the microstructure was characterized as the evaluation criteria. The effects of the processing parameters, such as, the influence of the pressing distance, hot pressing pressure, hot pressing temperature and hot pressing time on the microstructure replication were investigated. When the pressing distance is 1.4 mm, the hot pressing temperature is 130℃, the hot pressing pressure is 4 kN, and the hot pressing time is 60 s, the double-sided microstructure can be better formed. 
关键词:双面微流控芯片;热压成型;数值模拟;聚甲基丙烯酸甲酯 
Keywords:double-sided microfluidic chip; hot embossing; numerical simulation; polymethyl methacrylate 
基金:长沙市科技计划项目(kh1902095) 
本文引用格式:
左思璐,傅志红,余文清. PMMA双面微流控芯片热压成型数值模拟[J].工程塑料应用,2021,49(6):84-88,94.
Zuo Silu,Fu Zhihong,Yu Wenqing. Numerical simulation of hot embossing of PMMA double-sided microfluidic chip[J]. Engineering Plastics Application,2021,49(6):84-88,94. 

原文:
 
相似文章:
  光纤激光打标工艺对黑色PMMA材料打标效果的影响
2021年第08期
  注塑机用波状型分离螺杆混炼性能数值模拟
2021年第06期
  叶片转子对塑料熔体挤压输送作用及其分析
2021年第05期
  PMMA/棉花纤维素复合薄膜的制备及性能
2021年第01期
  微孔发泡注塑成型工艺泡孔尺寸影响因素分析
2020年第11期
  新型偏心啮合盘元件的混沌混合特性
2020年第03期
  PVC-U挤出机头各参数对熔体流动的影响
2020年第03期
  VARI成型V型构件固化变形和影响因素分析
2020年第01期
  抗紫外PC/PMMA交替微层复合薄膜的制备与性能
2019年第10期
  聚合物间歇微发泡泡孔形态演化过程的数值分析
2019年第09期
《工程塑料应用》杂志社 版权所有,未经授权禁止复制或者建立镜像
地址:山东省济南市天桥区田庄东路3号 邮编:250031
电话:0531-85878057 85878223 85878148 85878278
鲁ICP备05018524号-5